ZIP-Ram und Sockel

The zig-zag in-line package or ZIP was a short-lived packaging technology for integrated circuits, particularly dynamic RAM chips. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 20 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05„), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages (TSOPs) used on single-in-line memory modules (SIMMs) and dual-in-line memory modules (DIMMs).

Übersetzung gesucht

Generell gilt wohl: 514400: fast page mode 514402: static column

Eselsbrücke:

….0 bzw. ….6 normal
….2 bzw. ….8 static column

in der Mitte steht die Größe 4 x 256 bzw. 4 x 258 (ist aber natürlich 256) 4 x 400 soll wohl 4x 4×256=1000 heißen
Nullen in der Mitte sind für 1024

• Quelle
  • https://en.wikipedia.org/wiki/Zig-zag_in-line_package
• Datenblatt
• siehe auch
  • RAM